Achieving exceptional tensile strength in electrodeposited copper through grain re finement and reinforcement effect by co -deposition of few layered graphene

dc.contributor.author	MATHEW, RT
dc.contributor.author	SINGAM, S
dc.contributor.author	KOLLU, P
dc.contributor.author	BOHM, S
dc.contributor.author	PRASAD, MJNV
dc.date.accessioned	2021-03-10T08:11:40Z
dc.date.available	2021-03-10T08:11:40Z
dc.date.issued	2020
dc.identifier.citation	JOURNAL OF ALLOYS AND COMPOUNDS 840	en_US
dc.identifier.issn	0925-8388
dc.identifier.issn	1873-4669
dc.identifier.uri	http://localhost:8080/xmlui/handle/100/28805
dc.language.iso	English	en_US
dc.publisher	ELSEVIER SCIENCE SA	en_US
dc.subject	STACKING-FAULT ENERGY	en_US
dc.subject	CU-AL ALLOYS	en_US
dc.subject	MECHANICAL-PROPERTIES	en_US
dc.subject	MATRIX COMPOSITES	en_US
dc.subject	ELECTROCHEMICAL DEPOSITION	en_US
dc.subject	ENHANCED STRENGTH	en_US
dc.subject	DUCTILITY SYNERGY	en_US
dc.subject	BEHAVIOR	en_US
dc.subject	NANOCRYSTALLINE	en_US
dc.subject	MICROSTRUCTURE	en_US
dc.title	Achieving exceptional tensile strength in electrodeposited copper through grain re finement and reinforcement effect by co -deposition of few layered graphene	en_US
dc.type	Article	en_US