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https://dspace.library.iitb.ac.in/jspui/handle/100/13993| Title: | Preparation and Properties of New Polyphenylene Sulfide/AlN Composites for Electronic Packaging |
| Authors: | GOYAL, RK JADHAV, P TIWARI, AN |
| Keywords: | Thermal-Conductivity Melt Intercalation Nanocomposites Particles Behavior Expansion Friction Tio2 Wear |
| Issue Date: | 2011 |
| Publisher: | SPRINGER |
| Citation: | JOURNAL OF ELECTRONIC MATERIALS,40(6)1377-1383 |
| Abstract: | The thermal, mechanical, and dielectric properties of new high-performance polyphenylene sulfide/aluminum nitride (AlN) composites prepared by hot pressing were investigated for use in electronic packaging. The coefficient of thermal expansion was decreased by 41%. The glass-transition temperature and Vickers microhardness were increased by 13A degrees C and 46%, respectively, for the 15.1 vol.% AlN composite. A modified rule of mixtures with beta of 0.065 fits the data. The dielectric constant and loss factor of the composites are within the range of requirements for commercial use. |
| URI: | http://dx.doi.org/10.1007/s11664-011-1520-5 http://dspace.library.iitb.ac.in/jspui/handle/100/13993 |
| ISSN: | 0361-5235 |
| Appears in Collections: | Article |
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