DSpace
 

DSpace at IIT Bombay >
IITB Publications >
Article >

Please use this identifier to cite or link to this item: http://dspace.library.iitb.ac.in/jspui/handle/10054/6198

Title: Preparation and properties of silica filled PTFE flexible laminates for microwave circuit applications
Authors: MURALI, KP
RAJESH, S
PRAKASH, O
KULKARNI, AR
RATHEESH, R
Keywords: dielectric-constant
composites
model
Issue Date: 2009
Publisher: ELSEVIER SCI LTD
Citation: COMPOSITES PART A-APPLIED SCIENCE AND MANUFACTURING, 40(8), 1179-1185
Abstract: Micron and nano size silica fillers are incorporated in the PTFE matrix to prepare flexible composite substrates. A proprietary process comprising of sigma mixing, extrusion, calendering followed by hot pressing (SMECH process) has been employed to obtain nearly isotropic and dimensionally stable filled PTFE substrates. Theoretical modeling has been employed to predict the effective dielectric constant of the composite system and validated the results with experimental data. The distribution of particulate filler in the PTFE matrix has been studied using scanning electron microscopy. The linear coefficient of thermal expansion and ultimate tensile strength of the composite systems with respect to filler loading have been found out. Dielectric properties of the composite substrates at X-band frequency (8.2-12.4 GHz) are measured using waveguide cavity perturbation technique. Moisture absorption of fused silica filled substrates is found out conforming to IPC-TM-650 2.6.2. (C) 2009
URI: http://dx.doi.org/10.1016/j.compositesa.2009.05.007
http://dspace.library.iitb.ac.in/xmlui/handle/10054/6198
http://hdl.handle.net/10054/6198
ISSN: 1359-835X
Appears in Collections:Article

Files in This Item:

There are no files associated with this item.

View Statistics

Items in DSpace are protected by copyright, with all rights reserved, unless otherwise indicated.

 

Valid XHTML 1.0! DSpace Software Copyright © 2002-2010  Duraspace - Feedback