Please use this identifier to cite or link to this item: http://dspace.library.iitb.ac.in/xmlui/handle/10054/586
Title: Photoplastic NEMS with an encapsulated polysilicon piezoresistor
Authors: KALE, NS
NAG, S
PINTO, RICHARD
RAMGOPAL RAO, V
Keywords: Cantilevers
Nanotechnology
Piezoresistive Devices
Resistors
Issue Date: 2008
Publisher: IEEE
Citation: Proceedings of the 8th IEEE Conference on Nanotechnology, Arlington, USA, 18-21 August 2008, 460-463
Abstract: We demonstrate a photoplastic NEMS device that has an encapsulated polysilicon piezoresistor. The crucial temperature limitation of depositing a polysilicon film on a polymer was overcome by employing a novel Hotwire CVD process. In this paper, we report the fabrication and characterization of a novel polymeric cantilever with an embedded piezoresistor, which exploits the low Youngs modulus of a polymer and high gauge factor of polysilicon. Such devices are widely used for sensing biochemicals.
URI: 10.1109/NANO.2008.140
http://hdl.handle.net/10054/586
http://dspace.library.iitb.ac.in/xmlui/handle/10054/586
ISBN: 978-1-4244-2103-9
Appears in Collections:Proceedings papers

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