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Please use this identifier to cite or link to this item: http://dspace.library.iitb.ac.in/jspui/handle/10054/4466

Title: Stress wave attenuation in ceramic plates
Authors: NAIK, NK
GOEL, R
KULKARNI, MD
Keywords: ultrasonic-attenuation
grain-boundaries
elastic-modulus
armor
size
Issue Date: 2008
Publisher: AMER INST PHYSICS
Citation: JOURNAL OF APPLIED PHYSICS, 103(10), -
Abstract: Studies on planar longitudinal stress wave attenuation in thin ceramic plates are presented using a wave tracking algorithm. The results are also experimentally validated. Ceramic plates consist of grains and grain boundaries. Elastic modulus and density of the grain boundaries are less than those of the grains. When the planar longitudinal stress wave encounters an interface between the grain and the grain boundary, reflection and transmission of the incident stress wave take place because of the impedance mismatch at the interface. It is observed that this leads to attenuation in stress wave intensity. This behavior is represented by stress wave attenuation coefficient. It is observed that the stress wave attenuation coefficient is a material property. (C) 2008
URI: http://dx.doi.org/10.1063/1.2921971
http://dspace.library.iitb.ac.in/xmlui/handle/10054/4466
http://hdl.handle.net/10054/4466
ISSN: 0021-8979
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