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|Title:||A novel method of metallization for MMICs|
Electroless Deposited Coatings
Integrated Circuit Technology
|Citation:||IEEE Transactions on Components, Hybrids, and Manufacturing Technology 13(2), 281-83|
|Abstract:||A modified electroless method is described which may be an alternative to the conventional metallization techniques for monolithic microwave integrated circuits (MMICs). The measured loss performance of microstriplines fabricated from the new metallization revealed its superiority over the traditional methods. Experimental results agree with the theoretically computed results in the frequency range 2-12 GHz.|
|Appears in Collections:||Article|
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