DSpace
 

DSpace at IIT Bombay >
IITB Publications >
Article >

Please use this identifier to cite or link to this item: http://dspace.library.iitb.ac.in/jspui/handle/10054/10087

Title: An ecofriendly electroless copper plating process
Authors: BHATGADDE, LG
JOSEPH, S
Issue Date: 1996
Publisher: METAL FINISHERS ASSOC INDIA
Citation: TRANSACTIONS OF THE METAL FINISHERS ASSOCIATION OF INDIA, 5(4), 55-60
Abstract: The conventional electroless copper plating process poses environmental problems owing to toxicity and the resultant health hazards of formaldehyde. An alternative process employing sodium hypophosphite as a reducing agent and Ni++ ions as a mediator was reported in 1980s. However, there are no reports on commercial application of this process. Thereafter in 1990, a direct metallization system (DMS), which replaces electroless copper thereby eliminating the use of formaldehyde, was developed for PCB industry. This process also has limited uses. An attempt has been made to deposit electroless copper from a bath containing sodium hypophosphite and cobalt ions as a mediator. The properties of copper coatings obtained from this bath are compared with those of formaldehyde-reduced bath for electronic applications.
URI: http://dspace.library.iitb.ac.in/xmlui/handle/10054/10087
http://hdl.handle.net/10054/10087
ISSN: 0971-5304
Appears in Collections:Article

Files in This Item:

There are no files associated with this item.

View Statistics

Items in DSpace are protected by copyright, with all rights reserved, unless otherwise indicated.

 

Valid XHTML 1.0! DSpace Software Copyright © 2002-2010  Duraspace - Feedback