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Please use this identifier to cite or link to this item: http://dspace.library.iitb.ac.in/jspui/handle/10054/10086

Title: An ecofriendly electroless copper plating process
Authors: BHATGADDE, LG
JOSEPH, S
Issue Date: 1997
Publisher: METAL FINISHERS ASSOC INDIA
Citation: TRANSACTIONS OF THE METAL FINISHERS ASSOCIATION OF INDIA, 6(1), 55-60
Abstract: The conventional electroless copper plating process poses environmental problems owing to toxicity and the resultant health hazards of formaldehyde. An alternative process employing sodium hypophosphite as a reducing agent and Ni++ ions as a mediator was reported in 1980s. However there are no reports on commercial application of this process. Thereafter in. 1990, a direct metallization system (DMS), which replaces electroless copper thereby eliminating the use of formaldehyde, was developed for PCB industry. This process also has limited uses. An attempt has been made to deposit electroless copper from ct bath containing sodium hypophosphite and cobalt ions as a mediator. The properties of copper coatings obtained from this bath are compared with those of formaldehyde-reduced bath for electronic applications.
URI: http://dspace.library.iitb.ac.in/xmlui/handle/10054/10086
http://hdl.handle.net/10054/10086
ISSN: 0971-5304
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