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Please use this identifier to cite or link to this item: http://dspace.library.iitb.ac.in/jspui/handle/10054/10085

Title: A review of electroless plating techniques for electronics
Authors: BHATGADDE, LG
Keywords: printed-circuit boards
copper deposition
metal-deposition
fabrication
baths
Issue Date: 1997
Publisher: METAL FINISHERS ASSOC INDIA
Citation: TRANSACTIONS OF THE METAL FINISHERS ASSOCIATION OF INDIA, 6(3), 229-233
Abstract: This paper presents a survey on advances in electroless plating of copper, nickel, gold and palladium for fabrication of PWBs, semiconductors, EMI shieldings, computer memories and other components. Although considerable progress has been achieved in understanding the reduction mechanisms, upgrading the bath stability and enhancing the quality of electroless coatings. these processes suffer from an economic disadvantage owing to high cost of chemicals and low bath turn-overs. Besides, the number of reducing agents available for a given metallic/alloy coating has still remained at the 1960s' level. In the present context, many of them are environmentally incompatible. These and other issues involved in Large scale implementation of these techniques are discussed in the paper.
URI: http://dspace.library.iitb.ac.in/xmlui/handle/10054/10085
http://hdl.handle.net/10054/10085
ISSN: 0971-5304
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