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Please use this identifier to cite or link to this item: http://dspace.library.iitb.ac.in/jspui/handle/100/1245

Title: Radiation-assisted interactions between gold and copper across a Nickel barrier
Authors: BHATTACHARYYA, VP
PRABHAWALKAR, PD
Keywords: bombardment
alloys
cu
au
Issue Date: 1991
Publisher: ELSEVIER SCIENCE SA LAUSANNE
Citation: THIN SOLID FILMS,196(2)235-242
Abstract: Previously we had studied the effect of nitrogen bombardment on the interface of thin electrodeposited films of copper and gold. In practical applications thin films of nickel are used between as barrier layers. Extensive interdiffusion was observed between gold and copper layers under the influence of ion bombardment, without practically disturbing the nickel layer between. The resulting composition after bombardment from the copper side is discussed and a mechanism for the process is suggested.
URI: http://dx.doi.org/10.1016/0040-6090(91)90367-7
http://dspace.library.iitb.ac.in/xmlui/handle/10054/14435
http://hdl.handle.net/100/1245
ISSN: 0040-6090
Appears in Collections:Proceedings papers

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