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|Title:||Radiation-assisted interactions between gold and copper across a Nickel barrier|
|Publisher:||ELSEVIER SCIENCE SA LAUSANNE|
|Citation:||THIN SOLID FILMS,196(2)235-242|
|Abstract:||Previously we had studied the effect of nitrogen bombardment on the interface of thin electrodeposited films of copper and gold. In practical applications thin films of nickel are used between as barrier layers. Extensive interdiffusion was observed between gold and copper layers under the influence of ion bombardment, without practically disturbing the nickel layer between. The resulting composition after bombardment from the copper side is discussed and a mechanism for the process is suggested.|
|Appears in Collections:||Proceedings papers|
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